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Title:
THERMOPLASTIC RESIN BAND, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2003237822
Kind Code:
A
Abstract:

To provide a band which enhances the strength of the thermoplastic resin band in a stretching direction and the strength thereof in the width direction, prevents any load collapse after the binding attributable to the slackness due to the stress relaxation, reduces the elongation due to secular changes by the creep, and develops no longitudinal cracking.

A step of irradiating a resin with the photosensitive (light) wavelength is included in any one of steps A, B and C in a series of manufacturing steps of the thermoplastic resin band 1, the intermolecular crosslinking is promoted by irradiation with the photosensitive wavelength using the photosensitive resin together with the physical molecular orientation of the stretching, and the tough thermoplastic resin band of the molecular three-dimensional structure is obtained, in which the longitudinal cracking property and the stress relaxation are enhanced, and the shrinkage rate is low.


Inventors:
KOIDE TAKASHI
TACHIKA SATORU
MARUTANI TETSUYA
Application Number:
JP2002037530A
Publication Date:
August 27, 2003
Filing Date:
February 15, 2002
Export Citation:
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Assignee:
SEKISUI JUSHI KK
International Classes:
B65D63/10; B32B27/08; C08J7/00; C08L101/00; (IPC1-7): B65D63/10; B32B27/08; C08J7/00; C08L101/00



 
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