Title:
HEAT-CURABLE RESIN COMPOSITION, RESIN LAYER WITH SUPPORT, RESIN MOLDED BODY, AND METHOD FOR MANUFACTURING ELECTRICAL EQUIPMENT COMPONENT
Document Type and Number:
Japanese Patent JP2023054902
Kind Code:
A
Abstract:
To provide a heat-curable resin composition that can satisfy both impregnating ability of a resin material into a coil or the like, and handleability.SOLUTION: A heat-curable resin composition is intended to insulate and adhere at least a part of an electrical equipment component, and includes an epoxy resin that is liquid at atmospheric temperature, a phenolic curing agent, and a curing accelerator. A ratio of the number of epoxy groups of the epoxy resin that is liquid at atmospheric temperature in the heat-curable resin composition to the number of phenolic hydroxy groups of the phenolic curing agent in the heat-curable resin composition is 1.50-4.00.SELECTED DRAWING: Figure 1
Inventors:
SATO NAOHITO
UCHIDA HIROAKI
UCHIDA HIROAKI
Application Number:
JP2021163880A
Publication Date:
April 17, 2023
Filing Date:
October 05, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
C08G59/62; H01F41/04
Attorney, Agent or Firm:
Akihiko Yamashita
Tatsuto Kishimoto
Tatsuto Kishimoto