Title:
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2003183519
Kind Code:
A
Abstract:
To provide a thermosetting resin composition excellent in curability and preservability, and a semiconductor using the composition.
The thermosetting resin composition comprises a thermosetting resin (A), and a substituted or unsubstituted vinylpyridine polymer or derivative thereof (B) or a substituted or unsubstituted vinylpyridine copolymer with another reactive monomer or a derivative thereof (C) as essential components. The semiconductor is sealed by the thermosetting resin compositions.
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Inventors:
OKUBO AKIKO
GO YOSHIYUKI
GO YOSHIYUKI
Application Number:
JP2001388349A
Publication Date:
July 03, 2003
Filing Date:
December 20, 2001
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; C08G59/42; C08K3/00; C08L39/08; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L101/00; C08G59/42; C08K3/00; C08L39/08; C08L63/00; H01L23/29; H01L23/31
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