Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0415219
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. having low-stress properties and a high reliability and being useful for TAB sealing by compounding a trifunctional epoxy resin, bisphenol A and/or bisphenol AD epoxy resin, a silicon-contg. epoxy compd., a phenol novolac resin, and an organosilicon compd. CONSTITUTION:100 pts.wt. trifunctional epoxy resin of formula 1, 1-900 pts.wt. epoxy resin component comprising a bisphenol A epoxy resin of formula II (wherein (n) is 0 or an integer of 1 or higher) having an epoxy equivalent of 170-400 and/or a bisphenol AD epoexy resin of formula III (wherein (n) is 0 or an integer of 1 or higher) having an epoxy equivalent of 163-400, 0.1-900 pts.wt. silicon-contg. epoxy compd. having at least one structural unit of formula IV (wherein (n) is 2 or 3; R is 1-20C alkyl, alkoxy, etc.; and (m) is 0 or an integer of 1-4) directly attached to a silicon atom in the molecule, 10-900 pts.wt. phenol novolac epoxy resin of formula V (wherein R' is 1-10C alkyl, vinyl, etc.; (k) is 0 or an integer of 1-18; and the mean value of (l) is 0-3), and 0.001-500 pts.wt. organosilicon compd. having at least two alkoxy or hydroxyl groups directly attached to a silicon atom in the molecule are compounded.
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Inventors:
HIROSE SHOICHI
BANDO IWAO
BANDO IWAO
Application Number:
JP11949990A
Publication Date:
January 20, 1992
Filing Date:
May 08, 1990
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L63/00; C08G59/00; C08G59/20; C08G59/30; C08G59/32; C08K5/5435; H01L23/29; H01L23/31; (IPC1-7): C08G59/32
Next Patent: JPH0415220