Title:
THIN FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JP2000192228
Kind Code:
A
Abstract:
To provide a thin film forming device having a vapor ejecting device which is free from condensation of a molten substance even when the heating of the device is stopped.
In a thin film forming device to form a thin film consisting of a molten substance on a material to be deposited by ejecting the vapor of the molten substance from a nozzle, a vaporizer nozzle 3c fitted to a vaporizer 1 of a vapor ejecting device to melt a metal and deposit its vapor on the material to be deposited, a nozzle retainer 4c, and a guide cylinder 5c are formed of high purity carbon.
Inventors:
SAKAMOTO TETSUYA
Application Number:
JP37246398A
Publication Date:
July 11, 2000
Filing Date:
December 28, 1998
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23C14/24; (IPC1-7): C23C14/24
Attorney, Agent or Firm:
Masuo Oiwa
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