Title:
THIN FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JPS594433
Kind Code:
A
Abstract:
PURPOSE: To remarkably enhance uniformity of film thickness, by forming a recess having a depth similar to the thickness of a base on the surface of an electrode on which the base is to be placed, fitting the base to the recess, and leveling both surfaces of the base and the electrode to the same height.
CONSTITUTION: The recess 7 is formed on the surface of a lower electrode 2, the base 5 is fitted to the recess 7, and both faces of the electrode, and the base are leveled equally. The use of such a device raises the uniformity of film thickness and film quality, and enhances film quality.
Inventors:
NOZAKI HIDETOSHI
UTAGAWA TADASHI
KAMIMURA TAKAAKI
HATAYAMA TAMOTSU
UTAGAWA TADASHI
KAMIMURA TAKAAKI
HATAYAMA TAMOTSU
Application Number:
JP11297882A
Publication Date:
January 11, 1984
Filing Date:
June 30, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01J37/32; B01J15/00; C23C16/50; (IPC1-7): B01J15/00
Domestic Patent References:
| JPS5590438A | 1980-07-09 | |||
| JPS592132B2 | 1984-01-17 | |||
| JPS5773176A | 1982-05-07 | |||
| JPS5447576A | 1979-04-14 |
Attorney, Agent or Firm:
Takehiko Suzue
Next Patent: VAPOR PHASE REACTOR