To process a scribe region so as neither to damage a substrate nor to cause remaining of a film by preventing excessive energy in a superposed portion between processing spots in a thin film scribe using laser beam.
There are provided a thin film laser patterning method and a thin film laser patterning device which irradiate a thin film formed on a surface of a sample with pulsed laser beam while relatively scanning the pulsed laser beam on the surface of the sample, thereby partially removing the thin film from the surface of the sample. In the method and the device, the pulsed laser is formed so as to have the intensity distribution of a top hat shape which is asymmetrical to the relatively scanning direction. An irradiation region of the formed pulsed laser is irradiated with the pulsed laser beam while partly overlapping the region, thereby performing relative scanning, so that the thin film on the irradiated region is removed.
HONGO MIKIO
ARAKI MASAKI
