To provide a thin plate-like component handling device picking out thin plate-like components one by one and reliably separating the second-layer component from the doubled components when sucked.

The thin plate-like component handling device 1 includes a holder 10 holding the plurality of thin plate-like components in layers, a vacuum chuck 40 applied to uppermost one of the thin plate-like components, a chuck drive mechanism moving the vacuum chuck forward or backward, and a nozzle 70 applying an air stream to the thin plate-like component sucked to the chuck 40. The vacuum chuck 40 consists of at least three small-diameter pipes 41 dispersedly applied to the surface of the thin plate-like component, and pressure in each small-diameter pipe 41 can be selected to be vacuum or positive. The direction of moving the chuck 40 forward or backward is inclined 80-10° to the gravity direction.