To provide a through-wire board and a composite board with a high degree of designing a wire structure and provided with through-wires capable of highly dense three-dimensional mount, and to provide an electronic apparatus employing them.
The through-wire board is provided with a base member (11) wherein a very small hole (12) tying at least two sides (11a or 11b and 11c) of the base member (11), and the through-wire (13) formed by filling a conductive substance in the very small hole (12), are provided, and at least part of the through-wire (13) is extended in a direction different from the thick direction of the base member (11) (all of the through-wire (13) in the case of Fig. 1). The composite board is disclosed, and the electronic apparatus is disclosed employing the through wire board and the composite board.
| WO/2000/036886 | CONDUCTIVE CONNECTING PIN AND PACKAGE BOARD |
| WO/2024/022077 | DISPLAY PANEL AND DISPLAY DEVICE |
| JP2022115402 | WIRING CIRCUIT BOARD |
HASHIMOTO MIKIO
| JP2000216514A | 2000-08-04 | |||
| JP2004311720A | 2004-11-04 | |||
| JPH05259599A | 1993-10-08 | |||
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| JP2001203457A | 2001-07-27 | |||
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| JP2005019576A | 2005-01-20 |
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama