Title:
【発明の名称】セラミック配線基板の製造方法
Document Type and Number:
Japanese Patent JP2738601
Kind Code:
B2
Inventors:
KOKUBU MASAYA
Application Number:
JP12346491A
Publication Date:
April 08, 1998
Filing Date:
May 28, 1991
Export Citation:
Assignee:
KYOSERA KK
International Classes:
H01L23/15; H01L23/13; H05K1/03; H05K3/00; (IPC1-7): H05K3/00; H01L23/13; H05K1/03
Domestic Patent References:
| JP1194490A |