PURPOSE: To provide a thermoelectric cooling module which can be thinned without deterioration of its cooling capacity by positioning a ceramic board for heat absorption and a ceramic board for heat generation nearly on the same plane.

CONSTITUTION: For a square-shaped ceramic board 31, a wiring pattern 36 is applied on the outer side face, and a ceramic board 31 has an inner side face larger than the outer side face of the ceramic board 3, and also a wiring pattern 37 is applied on the inner side face. A plurality of thermoelectric elements 33 are arranged between the ceramic boards 31 and 33, and a plurality of thermoelectric elements 33, the wiring patterns 36 and 37, and a pair of electrode terminals 34 for current supply provided on the ceramic board 32 are connected into in series circuits. What is more, the respective wide faces of the ceramic boards 31 and 32 are nearly on the same plane.