Title:
【発明の名称】半導体パッケージの成形可能な高強度リードフレームの製造方法
Document Type and Number:
Japanese Patent JPH02501967
Kind Code:
A
Abstract:
A glass sealed semiconductor package (10) includes a metal base number (12), a metal housing or lid member (14) shaped to provide a hollow enclosure (16) for receiving an electronic component (18). A leadframe (20) with a top surface (29) is sealed between the cover (14) and base (12) by a sealing glass (22) such as a lead borate type glass and filler. The leadframe (20) is constructed from a precipitation hardenable copper alloy which is relatively soft prior to exposure to the glass sealing times and temperatures and the leadframe legs (24, 26) may be readily bent to a desired radius. The leadframe is much harder subsequent to the exposure to the glass sealing times and temperatures and resists flexure.
Inventors:
Muffler, Deepak
Sale, Youssef
Sale, Youssef
Application Number:
JP50134488A
Publication Date:
June 28, 1990
Filing Date:
January 12, 1988
Export Citation:
Assignee:
OLIN CORPORATION
International Classes:
H01L23/02; H01L23/10; H01L23/495; H01L23/50; H05K5/00; (IPC1-7): H01L23/02; H01L23/50
Attorney, Agent or Firm:
Akira Asamura (3 outside)
Previous Patent: JPH02501966
Next Patent: DUST DISPOSAL SYSTEM IN CAR WASHING FOR DUST COLLECTING CAR
Next Patent: DUST DISPOSAL SYSTEM IN CAR WASHING FOR DUST COLLECTING CAR