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Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3359535
Kind Code:
B2
Abstract:
A fine particulate polishing agent comprises fine particles of a solid solution composed of single-crystal ceric oxide and silicon dioxide and fine particles of silicon dioxide. A slurry polishing agent comprising the fine particulate polishing agent can be prepared by a method which comprises the steps of mixing, with stirring, single-crystal ceric oxide fine particles, silica sol and a liquid; drying the mixture; subjecting the dried particulate material to a thermal treatment at a high temperature, and then cooling the solid solution powder formed by the thermal treatment and composed of single crystal ceric oxide and silicon dioxide; again mixing the powder with silica sol and a liquid; and then subjecting the mixture to deagglomeration using a wet pulverizing mill to give a slurry.

Inventors:
Kenzo Hanawa
Tadayoshi Mochizuki
Shigeo Ueda
Kazuhiko Kato
Application Number:
JP10875597A
Publication Date:
December 24, 2002
Filing Date:
April 25, 1997
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B24B37/00; B82Y10/00; B82Y30/00; B82Y99/00; C01B33/113; C01B33/18; C01F17/00; C09G1/02; C09K3/14; H01L21/304; H01L21/3105; (IPC1-7): H01L21/304; B24B37/00; C01B33/113; C01F17/00; C09K3/14
Domestic Patent References:
JP1266183A
JP2209730A
JP6044577A
JP63169262A
JP8153779A
Attorney, Agent or Firm:
Nobuto Watanabe (1 person outside)