Title:
【発明の名称】半導体製造における波長補正の方法
Document Type and Number:
Japanese Patent JP2002533940
Kind Code:
A
Abstract:
The present invention relates to a method for manufacturing a plurality of semiconductor photonic integrated circuit comprising at least a laser and a modulator connected optically to one another. Each laser and modulator has a waveguide layer being implemented on a single substrate, where said modulator is formed by use of a selective area growth technique. By providing modulator masking parts with selectable width to compensate a difference in band-gap energy in the waveguide layer between the laser and the modulator a approximate uniform difference in band-gap energy between the optically connected laser and modulator may be obtained.
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Inventors:
Bends, Eskill
Lund Kvist, Rennaruto
Lund Kvist, Rennaruto
Application Number:
JP2000590261A
Publication Date:
October 08, 2002
Filing Date:
December 15, 1999
Export Citation:
Assignee:
Telefon Acty Boraget Elm Ericson (Pubble)
International Classes:
H01L33/00; H01S5/026; H01S5/20; (IPC1-7): H01S5/026
Attorney, Agent or Firm:
Akira Asamura (3 outside)