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Patent Searching and Data


Title:
MANUFACTURE OF CHIP FOR SHIELDING ELECTROMAGNETIC WAVE COMPOSITION
Document Type and Number:
Japanese Patent JPS60179204
Kind Code:
A
Abstract:

PURPOSE: To produce effectively the chip in which the length of metallic fiber is kept at a specified length by a method in which the metallic long fiber having been bundled into a tow shape is dipped into the bath of thermoplastic resin monomer and the thermoplastic resin stuck thereon is polymerized, and then the metallic long fiber coated with the thermoplastic resin polymer having been formed, is cut into suitable length.

CONSTITUTION: The metallic long fibers made by drawing process, i.e. each fiber of aluminium, copper and brass, may be used for the metallic long fibers bundled into a tow shape, and the diameter of the fiber is about 1W100μm. The metallic long fibers bundled in such a tow shape are dipped in the bath of thermoplastic resin monomer. 5wt% thermoplastic resin monomer is preferably stuck to the metallic fiber. Next, the thermoplastic resin monomer stuck onto the metallic fiber is polymerized, and the layer of the thermoplastic resin polymer is formed on the surface of the metallic fiber. The obtained metallic fiber is cut into a suitable length, and thus, the chip for shielding electromagnetic wave composition may be obtained.


Inventors:
AKAKABE MICHIO
TAKAHASHI HITOSHI
Application Number:
JP3692984A
Publication Date:
September 13, 1985
Filing Date:
February 28, 1984
Export Citation:
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Assignee:
FUJIKURA RUBBER WORKS LTD
International Classes:
H05K9/00; B29B9/06; B29B9/14; H01B1/22; B29K105/22; (IPC1-7): B29K105/22; H01B1/22; H05K9/00
Attorney, Agent or Firm:
Amamiya Masaki