SUPERCONDUCTIVE CIRCUIT SUBSTRATE

Japanese Patent JPS59139687

A

PURPOSE:To contrive to simplify a constitution to be formed as a superconductive circuit substrate and to simplify the manufacturing process thereof as well as to cut down the manufacturing cost by a method wherein a thick board of a superconductive metal such as Nb and the like is used as the substrate and stronger physical strength and more necessary superconductivity are imparted to the substrate. CONSTITUTION:A thick board consisting of Nb having a thickness of 100-1,000mum or the alloy of Nb, manufactured by rolling, is used as a substrate 6. This substrate 6 is made an oxide layer 7 having a thickness of 0.04mum or thereabouts form on the both surfaces of the one surface according to a method of anodic oxidation or sputtering, etc. In case transmission lines 5 are formed on the both surfaces of the substrate 6, the oxide layer 7 is formed on the both surfaces. On this oxide layer 7 is formed an Si oxide layer 4, for example, as an insulating layer with low dielectric constant and on the uppermost top of the layer 4 are formed the fine wire-shaped transmission lines 5 consisting of a superconductive metal such as Nb, etc., for example, and a superconductive circuit substrate is completed. This oxide layer 7 is a layer which alleviates a distortion due to the adhesion between the substrate 6 and the Si oxide layer 4, while the Si oxide layer 4 is a layer, which ensures the electric insulating property between the substrate 6 and the transmission lines 5 as well as imparts the prescribed transmitting characteristic to the transmission lines 5. Material to be used and the thicknesses thereof are determined on the basis of these conditions.

HORIKOSHI EIJI
YAMANAKA KAZUNORI
KAWARADA MOTONOBU

JP1410283A

August 10, 1984

January 31, 1983

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FUJITSU LTD

H01L39/22; (IPC1-7): H01L39/22

Koshiro Matsuoka

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