Title:
TREATING APPARATUS
Document Type and Number:
Japanese Patent JPS61290725
Kind Code:
A
Abstract:
PURPOSE:To enable a treating material to be consumed uniformly in all the objects to be treated for the purpose of treating the objects uniformly, by supplying the treating material into a treating chamber receiving the objects to be treated just in a quantity required for the treatment. CONSTITUTION:When wafers 4 are introduced in or taken out of a processing tube 1, a temperature within the processing tube 1 is held at such a level that the oxidation in the tube is controlled negligibly. After the wafers are intro duced, the processing tube 1 is evacuated through an exhaust port 1 and then the temperature with the tube is raised by means of a heater 2. When the tem perature attains a predetermined value, an oxidizing agent 8 is supplied through a supply port 9 into the processing tube 1 in a quantity required by a film formed on the wafer 4 to have a thickness as desired. The supply of the required quantity of the oxidizing agent is controlled accurately by a control unit 11. Since the wafers 4 have no difference in thermal hysteresis according to this method, they are all uniformly provided with the oxide films without variations while the thickness of the oxide films is accurately controlled.
Inventors:
KOSAKA YUJI
AOSHIMA TAKAAKI
YOSHINAKA AKIRA
KOBAYASHI MASASHI
AOSHIMA TAKAAKI
YOSHINAKA AKIRA
KOBAYASHI MASASHI
Application Number:
JP13180485A
Publication Date:
December 20, 1986
Filing Date:
June 19, 1985
Export Citation:
Assignee:
HITACHI LTD
HITACHI MICROCUMPUTER ENG
HITACHI MICROCUMPUTER ENG
International Classes:
H01L21/205; H01L21/31; (IPC1-7): H01L21/205; H01L21/31
Attorney, Agent or Firm:
Katsuo Ogawa
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