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Patent Searching and Data


Title:
ULTRA-FINE ABRASIVE GRAIN CUTTING WHEEL AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH11179665
Kind Code:
A
Abstract:

To exhibit a high performance over a long period without an ultra-fine abrasive grain layer being peeled from a base even under a sever condition of high-speed feed and deep cutting by providing a brazing material layer in the boundary between the base and the ultra-fine abrasive grain layer.

The whole body of a base 1 is washed, and integrated into a molding die, and a mixture obtained by mixing a diamond abrasive grain to a resin bond mainly composed of a phenolic resin so as to have a concentration degree of 100 is filled therein. The die is then pressurized with heating to fix a resin bond ultra-fine abrasive grain layer 2 on the surface of the brazing material layer 3 of a cemented carbide base 1 simultaneously with the formation. After cooling, the molding completed product is taken out from the die, and the circumference and side surface of the ultra-fine abrasive grain layer 2 are tooled and dressed to manufacture a resin bond diamond cutting wheel.


Inventors:
OKANISHI YUKIO
INOUE HARUO
Application Number:
JP37008597A
Publication Date:
July 06, 1999
Filing Date:
December 18, 1997
Export Citation:
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Assignee:
OSAKA DIAMOND IND
International Classes:
B24D3/00; B24D3/06; B24D5/02; (IPC1-7): B24D3/00; B24D3/00; B24D3/06; B24D5/02