Title:
GRINDING WHEEL AND GRINDING DEVICE MOUNTING THIS GRINDING WHEEL
Document Type and Number:
Japanese Patent JPH11179664
Kind Code:
A
Abstract:
To manufacture a semiconductor wafer of within 0.15 μm surface roughness and within 1 μm thickness accuracy, without deteriorating productivity in a manufacturing process of the semiconductor wafer.
A grinding wheel of 2000 kgf/mm2 to 4200 kgf/mm2 Young's modulus is provided, which is constituted by a wheel base and a grinding part secured to the wheel base, to form the grinding part as a grinding wheel fixing an abrasive grain by a bonding agent. A grain size of the abrasive grain is set to 0.3 μm to 2.0 μm, volumetric ratio of a diamond abrasive grain is set to 2.5% to 12.5%.
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Inventors:
TAGUCHI RYOJI
HORIKOSHI MASAFUMI
DAII AKIJI
NANJO MASATOSHI
SAKAI TOSHIYUKI
IIDA KATSUFUMI
HORIKOSHI MASAFUMI
DAII AKIJI
NANJO MASATOSHI
SAKAI TOSHIYUKI
IIDA KATSUFUMI
Application Number:
JP34620997A
Publication Date:
July 06, 1999
Filing Date:
December 16, 1997
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24D3/00; B24D3/28; (IPC1-7): B24D3/00; B24D3/00; B24D3/28
Attorney, Agent or Firm:
Isao Sasaki (1 person outside)
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