VACUUM MOUNTING METHOD AND DEVICE FOR MEMS (MICRO ELECTRO MECHANICAL SYSTEM) ON SUBSTRATE

Title:

VACUUM MOUNTING METHOD AND DEVICE FOR MEMS (MICRO ELECTRO MECHANICAL SYSTEM) ON SUBSTRATE

Document Type and Number:

Japanese Patent JP2004160648

Kind Code:

A

Abstract:

To provide a vacuum mounting method and a device for MEMS on a substrate where the vacuum is controlled at a desired level and maintained at an original vacuum level even after a specified time.

A semiconductor substrate 30 where many MEMSs are formed and a lid member 20 consisting of a glass plate where a getter is adhered to a cavity are mutually faced in a vacuum chamber, and then a inert gas is provided from a gas injecting part connected to the vacuum chamber. The vacuum is controlled to be a specified level by controlling the gas injecting part 120 and a gas exhausting part 150. When the vacuum is stabilized, the lid member 20 is heated and then the semiconductor substrate 30 and the lid member 20 are bonded by applying a high voltage to the lid member under a condition that the lid member is heated at a specified temperature.

Inventors:

JUNG KYU-DONG
JUN CHAN-BONG
CHOI HYUNG
KANG SEOK-JIN
HONG SEOG-WOO
CHUNG SEOK-WHAN
LEE MOON-CHUL
LEE EUN-SUNG

Application Number:

JP2003378222A

Publication Date:

June 10, 2004

Filing Date:

November 07, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SAMSUNG ELECTRONICS CO LTD

International Classes:

B81C3/00; B81B7/00; H01L21/52; H01L23/02; (IPC1-7): B81C3/00; H01L23/02

Attorney, Agent or Firm:

Yukio Ono
Tomoko Inazumi

Previous Patent: NANO IMPRINTING STAMP MADE OF MICROCAST SILICON CARBIDE

Next Patent: TAPERED MULTILAYER THERMAL ACTUATOR AND ITS OPERATION METHOD