Title:
WAFER BONDING ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP3209544
Kind Code:
B2
Abstract:
PURPOSE: To obtain a required chip interval in the expanding step by a method wherein a radiation attenuating layer having almost the same plane shape as that of a wafer bonded to at least one surface of a base material is formed.
CONSTITUTION: An acryl base resin containing 3wt.% of 2,4-dihydroxy benzophenone is printed in a shape of 5 inch wafer on the surface of a soft vinyl chloride film used as a base material. Next, a composition comprising 100wt.% of acryl base polymer as a bonding agent, 100wt.% of urethane acrylate base oligomer in molecular weight of 8000 and 10wt.% of hardener is cast on a release agent comprising silicone-processed polyethylene terephthalate film to be bonded onto said base material for manufacturing an adhesive tape. Next, 5 inch wafer bonded onto the printing part of this adhesive tape is fitted to a flat frame to be full-cut into 5mm square chips. At this time, the chips are irradiated with ultraviolet rays from the base material side surface and finally, a dicing tape is expanded by 15%.
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Inventors:
Masao Kogure
Mineura Yoshihisa
Noguchi Hayato
Mineura Yoshihisa
Noguchi Hayato
Application Number:
JP19237391A
Publication Date:
September 17, 2001
Filing Date:
July 31, 1991
Export Citation:
Assignee:
Lintec Corporation
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/301
Domestic Patent References:
| JP2265258A | ||||
| JP366772A | ||||
| JP61276232A | ||||
| JP60223139A | ||||
| JP60196956A | ||||
| JP4233249A |
Attorney, Agent or Firm:
Shunichiro Suzuki