Title:
WAFER-CLEANING APPARATUS AND ITS SPRAY HEAD
Document Type and Number:
Japanese Patent JP3481608
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer-cleaning apparatus for preventing damages to a wafer and at the same time, cleaning the wafer completely, and to provide the spray head of the wafer-cleaning apparatus.
SOLUTION: The spray head of the wafer-cleaning apparatus jets water to a wafer, while moving relative to the wafer, and has a plurality of spray holes on a surface facing the wafer. The plurality of spray holes are laid so that the water being jetted from each spray hole covers the entire wafer surface, when the spray head moves relative to the wafer. The wafer washing apparatus comprises a base mount for placing the wafer, the spray head, an ultrasonic controller, a pulsation pressure controller, a controller, an input apparatus, a high-pressure pump, and a water supply apparatus.
Inventors:
Hu bamboo
Taka Kure
Taka Kure
Application Number:
JP2001198709A
Publication Date:
December 22, 2003
Filing Date:
June 29, 2001
Export Citation:
Assignee:
Promos Technologies, Inc.
International Classes:
B05B1/14; H01L21/304; (IPC1-7): H01L21/304; B05B1/14
Domestic Patent References:
| JP8274052A | ||||
| JP7211683A | ||||
| JP63305517A | ||||
| JP393230A |
Attorney, Agent or Firm:
Tadahiko Ito