To provide a wafer cleaning device of a dicing apparatus capable of improving throughput by enhancing a cleaning capacity.

A spinner 24 has triple nozzles 50, 50, 50. The spinner 24 has a rocking motor 54. The speed of the rocking motor 54 is controlled by a controller 26 so that it moves a nozzle head 48 at fixed speed along the surface of a wafer W fixed by a spinner table 40. Further, in the spinner 24, the diffusion angle of cleaning water by the nozzles 50 is set to a prescribed angle, and a cleaning water spraying region 70 to the wafer W is formed elliptically. Cleaning water spraying regions 70, 70, 70 of the adjacent nozzles 50, 50, 50 are partially overlapped on the surface of the wafer W, and the travel track 72 of the nozzle head 48 is set so that one of the overlapped cleaning water spraying regions 72, 72 passes a center O in the wafer W fixed onto the spinner table 40.