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Patent Searching and Data


Title:
WAFER HANDLING ROBOT
Document Type and Number:
Japanese Patent JP2003297895
Kind Code:
A
Abstract:

To easily conduct the automatic identification of a wafer for an integrated circuit.

The wafer 1 for an integrated circuit is provided on its surface with a resonance circuit 2 that radiates a resonance wave through resonance with the electromagnetic wave of a specific frequency inputted from the outside. A robot 21 comprises a wafer holding unit that holds the wafer 1 for an integrated circuit, an arm that transfers the wafer holding unit, a driving device that drives the arm, an antenna 24 installed on the arm, a sending unit S that emits the electromagnetic wave by utilizing the antenna 24, a receiver R that receives the resonance wave emitted by the resonance circuit 2 of the wafer 1 for an integrated circuit by utilizing the antenna 24, and an analyzer 32 that analyzes the resonance wave received by the receiver R. The analyzer 32 is so constituted as to analyze resonance characteristics of the resonance circuit 2 based on characteristics of the resonance wave received by the receiver R to detect information that is specific to the wafer 1 for the integrated circuit based on the resonance characteristics.


Inventors:
RIKITA NAOKI
INUI SHINICHIRO
Application Number:
JP2002093108A
Publication Date:
October 17, 2003
Filing Date:
March 28, 2002
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B25J15/08; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B25J15/08
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)