Title:
WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2001274230
Kind Code:
A
Abstract:
To provide a wafer holder for a semiconductor manufacturing device, which can prevent distortions due to heating and cooling and can be manufactured readily.
This wafer holder 10 has a structure where a pair of ceramic substrates 4 sandwich conductive layers 1, 2, 3. The conductive layers 1, 2, 3 have body portions 1A, 2A, 3A facing a wafer 20 and lead portions 1B, 2B, 3B led from the body portions 1A, 2A, 3A to be connected externally. The body portions 1A, 2A, 3A and the lead portions 1B, 2B, 3B are flush with each other.
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Inventors:
HIIRAGIDAIRA HIROSHI
NAKADA HIROHIKO
NAKADA HIROHIKO
Application Number:
JP2000160366A
Publication Date:
October 05, 2001
Filing Date:
May 30, 2000
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/302; H01L21/00; H01L21/205; H01L21/3065; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; H01L21/205; H01L21/3065
Attorney, Agent or Firm:
Hisami Fukami (4 outside)