Title:
WAFER-HOLDING FILM FOR DICING
Document Type and Number:
Japanese Patent JP3755617
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain chips with little chipping and improve the yield of nondefective products in chip production by using a wafer-holding film for dicing prepd. by coating a specific film substrate with a certain self-adhesive.
SOLUTION: This wafer-holding film is prepd. by coating a film substrate having a tensile modulus of 19.0MPa or higher and a thickness of 50-350μm with a 0.2-25μm-thick self-adhesive layer having a dynamic viscoelastic modulus of 8×10-10×10Pa. The figure shows the cutting operation in dicing seen from the upper side. When a water 10 is cut as a certain cutting point with a rotary wheelstone 7, cutting processed while chattering the wafer 10 delicately in the up-and-down and right-and-left directions and thus various large and small crazes appear as shown by a cutting line. Such crazes are decreased by using the holding film prepd. as above. Examples of the substrate are PET, OPP (biaxially oriented PP film), and PC. The self-adhesive used is an acrylic one, e.g. a commercially available one being usable.
Inventors:
Osamu Yamamoto
Hinomori Koji
Hinomori Koji
Application Number:
JP22917296A
Publication Date:
March 15, 2006
Filing Date:
August 30, 1996
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/02; C09J133/00; H01L21/301; (IPC1-7): C09J7/02; C09J7/02; C09J7/02; H01L21/301
Domestic Patent References:
| JP5175332A |
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