Title:
WAFER PHOTOLUMINESCENCE MAPPING APPARATUS
Document Type and Number:
Japanese Patent JP2628816
Kind Code:
B2
Abstract:
PURPOSE: To simply, rapidly and accurately measure and evaluate photoluminescence characteristics in a surface of a compound semiconductor wafer.
CONSTITUTION: The wafer photoluminescence mapping apparatus comprises intermittently interrupting means 6 for intermittently interrupting part of a continuous wave laser light from a laser light source 3 in a predetermined frequency to form an intermittent wave laser light, photodetecting means 12, 13 inputting photoluminescence generated by exciting the intermittent wave laser light to detect photoluminescence intensity, and an optical spectrum analyzer 19 inputting the photoluminescence generated by exciting the continuous wave laser light to obtain a photoluminescence spectrum. The apparatus further comprises moving means 10 for moving a measuring position in a compound semiconductor wafer, and display means for mapping-displaying photoluminescence characteristic distribution.
Inventors:
Masao Nakao
Application Number:
JP4954392A
Publication Date:
July 09, 1997
Filing Date:
March 06, 1992
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
G01N21/64; G01N21/00; H01L21/66; (IPC1-7): H01L21/66; G01N21/00; G01N21/64
Domestic Patent References:
| JP1182738A | ||||
| JP62189723A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)