Title:
WAFER PLATING DEVICE
Document Type and Number:
Japanese Patent JP3200468
Kind Code:
B2
Abstract:
PURPOSE: To prevent the deposition of dust and impurities on a wafer by removing a means for pressing the wafer downward when the wafer is plated from the space above the wafer.
CONSTITUTION: An air bag 6 is used as the pressing means to restrict the upper peripheral edge 13 of an expanded wafer 8 which is pressed down, and the air bag is contracted and restored to its original state when the wafer is not expanded to release the wafer. Consequently, the space above the wafer 8 need not be occupied by the pressing means when the wafer is plated or not.
Inventors:
Hirofumi Ishida
Application Number:
JP15298592A
Publication Date:
August 20, 2001
Filing Date:
May 21, 1992
Export Citation:
Assignee:
Nippon Electroplating Engineers Co., Ltd.
International Classes:
C25D7/12; C25D5/08; C25D17/06; H01L21/288; H01L21/60; (IPC1-7): C25D7/12
Domestic Patent References:
| JP3140494A | ||||
| JP1195025A | ||||
| JP7221109A | ||||
| JP586498A | ||||
| JP238472U |
Other References:
【文献】特許2798517(JP,B2)
Attorney, Agent or Firm:
Daisuke Tanaka