Title:
WAFER POLISHING APPARATUS
Document Type and Number:
Japanese Patent JP3520916
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus which can easily change the pressing region of a wafer.
SOLUTION: In the wafer polishing apparatus pressing a wafer W to a polishing pad 20 by air bags 34 arranged on a carrier 24, pressing region- restricting members 36 attached on the undersurface of the carrier 24 restrict the region where the air bugs 34 press the wafer. While a plurality of pressing region-restricting members 36 are prepared depending on different restricting regions, the region where the air bugs 34 press the wafer W can be changed by exchanging the pressing region-restricting members 36 appropriately.
Inventors:
Numamoto, Minoru
Application Number:
JP2000392637A
Publication Date:
April 19, 2004
Filing Date:
December 25, 2000
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B37/005; B24B37/04; B24B37/30; B24B49/16; H01L21/304; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; B24B37/04
Attorney, Agent or Firm:
松浦 憲三