Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP7007052
Kind Code:
B2
Abstract:
To provide a wafer processing method capable of preforming an alignment process through a sealing material including a carbon black coated on a surface of a wafer.SOLUTION: A method for processing a wafer in which a surface 11a of a device wafer in which a device is formed in the chip regions partitioned by a plurality of division schedule lines formed on a surface crisscross is sealed by a sealing material 23 and a plurality of bumps are formed comprises the steps of: detecting an alignment mark by transmitting the sealing material while obliquely irradiating the region imaged by visible light imaging means 28 with visible light by oblique light means 26 from a surface side of the wafer and detecting the division schedule line to be subjected to laser processing on the basis of the alignment mark (alignment step); forming a modified layer inside the device wafer and the sealing material by positioning a condensing point of a laser beam of a wavelength having permeability to the device wafer and the sealing material at the inside of the device wafer or the sealing material and irradiating the wafer with a laser beam from the surface side of the wafer; and a dividing step of applying external force to the device wafer and the sealing material and dividing the wafer into individual device chips whose surfaces are sealed by the sealing member with the modified layer as a division start point.SELECTED DRAWING: Figure 4
Inventors:
Katsuhiko Suzuki
Yuto Ban
Yuto Ban
Application Number:
JP2017178724A
Publication Date:
January 24, 2022
Filing Date:
September 19, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/08; B23K26/53
Domestic Patent References:
| JP2015028980A | ||||
| JP2014003274A | ||||
| JP2016166120A | ||||
| JP2014192238A |
Foreign References:
| WO2014156688A1 |
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Tomohiro Okamoto
Takahiro Kasahara