Title:
ウェーハの搬送装置及び搬送方法
Document Type and Number:
Japanese Patent JP7189722
Kind Code:
B2
Abstract:
To provide an apparatus for transferring a wafer to a suction surface of an electrostatic chuck, making the wafer be connected to the ground while sucking the wafer's top surface so as not to affect devices, transferring the wafer to the electrostatic chuck and making the wafer be sucked.SOLUTION: A transfer apparatus 2 comprises: means 20 for sucking and holding a wafer using negative pressure; and transfer means 21 for transferring the wafer to an electrostatic chuck 3. The sucking and holding means 20 comprises: a non-contact holding part 201 that is disposed on a base 200 and generates negative pressure by ejecting air to the wafer to suck and hold the wafer in a non-contact manner; three centering pins 202 disposed on the base 200 at equal angles; plate springs 24 for supporting the centering pins 202 so that the centering pins are movable upward with respect to a suction surface 31a of the electrostatic chuck 3; a pin 25 that is made to come into contact with the wafer's region having no influence on devices and made to be connected to the ground; and means 26 for conducting the pin 25 to the ground. The centering pins 202 each have an undersurface forming an inclined plane 202b having the outer peripheral side lower than the center side of the base 200.SELECTED DRAWING: Figure 6
Inventors:
Tomohiro Yamada
Eiichi Iida
Eiichi Iida
Application Number:
JP2018194154A
Publication Date:
December 14, 2022
Filing Date:
October 15, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/677; B65G49/07; H01L21/3065
Domestic Patent References:
| JP2016171292A | ||||
| JP2016201490A | ||||
| JP6077304A | ||||
| JP2014170923A |
Foreign References:
| WO2016052631A1 | ||||
| US20170358475 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office