Title:
WATERPROOF CONNECTOR
Document Type and Number:
Japanese Patent JP2785700
Kind Code:
B2
Abstract:
PURPOSE: To obtain a structure to resin mold the lead-in part of a wire, which has a high freedom of selecting the molding resin.
CONSTITUTION: In a structure in which a molding is carried out by molding resin 100 by inserting a terminal metal fitting 40 to which a wire 20 is connected, to the terminal insert opening 131 of the cavity 12 of a connector housing 10, a water-proof seal 30 adhered closely to the inner peripheral surface of the cavity 12 being housed from the terminal insert opening 131 of the cavity 12 is provided to the above terminal metal fitting 40. Consequently, even though a clearance is generated between the molding resin layer 100, and the wire 22 or the connector housing 10, and the water infiltration through the clearance, the invasion of the water is prevented securely by the water-proof seal 30.
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Inventors:
AOYAMA MASAHIKO
MAKINO HIROTAKA
MAKINO HIROTAKA
Application Number:
JP20923494A
Publication Date:
August 13, 1998
Filing Date:
August 09, 1994
Export Citation:
Assignee:
SUMITOMO DENSO KK
International Classes:
H01R13/52; (IPC1-7): H01R13/52
Domestic Patent References:
| JP601775A | ||||
| JP218532Y2 | ||||
| JP598295Y2 |
Attorney, Agent or Firm:
Kazuo Gero (1 person outside)
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