Title:
WIRE BONDING DEVICE
Document Type and Number:
Japanese Patent JP2016033931
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To effectively perform capillary heating without lowering bonding quality.SOLUTION: A wire bonding device for performing local heating on a bonding object includes: a capillary 40; pattern coils 34, 35 disposed, in a non-contact state, around the capillary 40; and a high frequency power source 50 for supplying predetermined high frequency power to the pattern coils 34, 35. The capillary 40 comprises: a base part 41; a metal layer 42 which is provided on the outer surface of the base part 41 and at which heat caused by electromagnetic induction is generated by the predetermined high frequency power applied to the pattern coils 34, 35; and a diamond layer 43 which covers the outer surface of the metal layer 42 and the tip of the base part 41 and transmits the heat generated at the metal layer to the bonding object.SELECTED DRAWING: Figure 2
Inventors:
MAEDA TORU
UTANO TETSUYA
UTANO TETSUYA
Application Number:
JP2012284948A
Publication Date:
March 10, 2016
Filing Date:
December 27, 2012
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
H01L21/60
Domestic Patent References:
| JPS4831691B1 | 1973-10-01 | |||
| JPH06268007A | 1994-09-22 | |||
| JPH0637155A | 1994-02-10 | |||
| JPS4831691B1 | 1973-10-01 | |||
| JPH06268007A | 1994-09-22 | |||
| JPH0637155A | 1994-02-10 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office
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