Title:
WIRE SAW CUTTING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2001328057
Kind Code:
A
Abstract:
To provide a wire saw cutting method and a device manufacturing workpieces having uniform thickness without any difference in the thickness.
This wire saw cutting method cuts the workpieces 7 by feeding slurry 10 between the wire 2 and the workpiece 7 while pressurizing the workpiece against a wire 2 (4) and traveling the wire 2 in the line direction. This wire saw cutting method detects the tension of the wire 2 and adjusts the tension of the wire 2 right before being fed to a cutting region and the tension of the wire 2 rewound from the cutting region based on the tension information. The wire saw used for it is also provided.
Inventors:
ISOGAI HIROMICHI
OKUBO KAZUYA
NAGAHAMA HIROMI
OKUBO KAZUYA
NAGAHAMA HIROMI
Application Number:
JP2000153709A
Publication Date:
November 27, 2001
Filing Date:
May 24, 2000
Export Citation:
Assignee:
TOSHIBA CERAMICS CO
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
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