Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2016033933
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board which can make a mounted semiconductor element fulfill its potential sufficiently by decreasing inductance of a power supply path in a segment region to a lower level.SOLUTION: A wiring board comprises: a power supply land pattern 2d which is connected to a power-supply semiconductor element connection pads P via via conductors and arranged under a segment region B and has a continuous belt-like part at a position corresponding to an outer periphery of the segment region B except an outer peripheral side of a mounting part A, in which the belt-like part and a power supply plane 4a arranged under the belt-like part are connected via the plurality of via conductors for connecting both. Inductance of a power supply path between the power-supply semiconductor element connection pad P and the power supply plane 4a is decreased to a lower level thereby to allow the mounting semiconductor element to fulfill its potential sufficiently.SELECTED DRAWING: Figure 1
Inventors:
NAKAGAWA YOSHIHIRO
Application Number:
JP2014155640A
Publication Date:
March 10, 2016
Filing Date:
July 31, 2014
Export Citation:
Assignee:
KYOCERA CIRCUIT SOLUTIONS INC
International Classes:
H01L23/12; H05K1/02
Domestic Patent References:
| JP2013089840A | 2013-05-13 | |||
| JP2013115062A | 2013-06-10 | |||
| JP2003188305A | 2003-07-04 | |||
| JP2002185141A | 2002-06-28 | |||
| JP2003158212A | 2003-05-30 | |||
| JP2003124377A | 2003-04-25 |
Foreign References:
| US7847404B1 | 2010-12-07 |