Title:
WIRING MATERIAL USING SOFT DILUTE COPPER ALLOY AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2013221163
Kind Code:
A
Abstract:
To provide a wiring material using an inexpensive soft dilute copper alloy which includes a crystal structure having a high electrical conductivity and high bending resistance and is simple in production process, and to provide a method for producing the same.
A wiring material uses a soft dilute copper alloy which is characterized in that the softening temperature is ≥100°C and ≤140°C, in the soft dilute copper alloy including copper and addition elements selected from the group comprising Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and the balance comprising inevitable impurities.
Inventors:
FUJITO KEISUKE
AOYAMA MASAYOSHI
KURODA HIROMITSU
WASHIMI TORU
SAGAWA HIDEYUKI
AOYAMA MASAYOSHI
KURODA HIROMITSU
WASHIMI TORU
SAGAWA HIDEYUKI
Application Number:
JP2012091966A
Publication Date:
October 28, 2013
Filing Date:
April 13, 2012
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C22C9/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
Nobuo Kinutani