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Patent Searching and Data


Title:
WOODY COMPOSITION BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH10286805
Kind Code:
A
Abstract:

To cut a manufacturing cost to a considerably low level without deteriorating the mechanical strength while maintaining a required surface smoothness by bonding and laminating a woody fiber board which is split in hales in the thickness direction using a slicer to one face or both faces of a woody base material in such a manner that the split face sides are turned up as front face sides.

Woody fiber boards 1a, 1b obtained by splitting a wood in halves in the thickness direction using a slicer 10 are bonded and laminated to one face or both faces of a woody base material 2 with the help of a formalin adhesive of urea resin or an acrylic adhesive so that the split face sides are turned up as front face sides, i.e., the split face sides do not become adhesive face sides with a woody base material 2 such as a plywood, a block board, a bonded wood or a particle board. Consequently, it is possible to obtain a laminate showing excellent adhesion with the same amount of coating of an adhesive as when the wood fiber board 1 is bonded and laminated as it is to the woody base material 2. further, the laminate shows almost the same physical property value and the same surface characteristics as the laminate comprising the wood fiber board 1 bonded to the woody base material 2. Thus the wooden composite board with high strength can be obtained at a low cost by making the woody base material 2 thick.


Inventors:
KAMISAKA TERUYOSHI
Application Number:
JP9716197A
Publication Date:
October 27, 1998
Filing Date:
April 15, 1997
Export Citation:
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Assignee:
EIDAI CO LTD
International Classes:
B27D1/04; B32B21/02; B32B21/13; E04C2/16; (IPC1-7): B27D1/04; B32B21/02; B32B21/13; E04C2/16
Attorney, Agent or Firm:
Yusuke Hiraki (1 person outside)