Title:
WORK HOLDER FOR ROTARY GRINDER FOR GRINDING OF SEMICONDUCTOR WAFER AND METHOD FOR POSITIONING OF SAID WORK HOLDER
Document Type and Number:
Japanese Patent JPH07122524
Kind Code:
A
Abstract:
PURPOSE: To provide the device and the method, which can adjust the relative space positions of the rotary axial line of a grinding tool and the rotary axial line of a work simply and highly accurately. CONSTITUTION: This is a work holder 1 for a rotary grinder for grinding a semiconductor wafer 10 and is the work holder 1 having a working plane 9, which faces the direction of a rotary grinding tool and mounts the semiconductor wafer 10 to be processed and is related to a piezoelectric element 2 for supporting the work holder 1 in the axial direction. Furthermore, the piezoelectric elements 2 can be independently operated. At the time of operation, the straight-line dimensions of the elements are changed. The operated piezoelectric element 2 moves the work holder up and down in the axial direction at the supporting position of the work holder 1.
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Inventors:
ANTON FUUBAA
ROBERUTO BUAISU
ROBERUTO BUAISU
Application Number:
JP21073394A
Publication Date:
May 12, 1995
Filing Date:
August 12, 1994
Export Citation:
Assignee:
WACKER CHEMITRONIC
International Classes:
B08B11/04; B23Q1/34; B23Q15/007; B23Q17/09; B24B7/04; B24B7/16; B24B7/22; B24B41/06; H01L21/304; B08B1/04; H01L21/68; H01L41/09; (IPC1-7): H01L21/304; B08B1/04; B08B11/04; B23Q15/007; B23Q17/09; B24B37/04; H01L21/68; H01L41/09
Domestic Patent References:
| JPS62124842A | 1987-06-06 | |||
| JPS62181862A | 1987-08-10 |
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)