Title:
触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法
Document Type and Number:
Japanese Patent JP4160598
Kind Code:
B2
Abstract:
The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.
Inventors:
Song-Hung Yi
Jean-Hoon Lee
Jean-Hoon Lee
Application Number:
JP2005518227A
Publication Date:
October 01, 2008
Filing Date:
July 23, 2004
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08F4/00; C23C18/18; C08F290/06; C23C18/16; C23C18/28; H05K9/00
Domestic Patent References:
| JP63200593A | ||||
| JP2001303255A | ||||
| JP7030227A |
Attorney, Agent or Firm:
Masatake Shiga
Shinya Mitsuhiro
Shinya Mitsuhiro