Title:
CONDUCTIVE LAMINATE
Document Type and Number:
Japanese Patent JP2023056354
Kind Code:
A
Abstract:
To provide a conductive laminate having excellent interlayer adhesion.SOLUTION: The present invention provides a conductive laminate comprising a polycarbonate substrate, on at least one side of which, an undercoat layer, a conductive layer comprising silver nanoparticles, and a copper plated layer are laminated. The undercoat layer comprises polyvinyl butyral and (3-mercaptopropyl) trimethoxysilane, and the weight ratio of polyvinyl butyral/(3-mercaptopropyl) trimethoxysilane is 95/5-60/40.SELECTED DRAWING: Figure 7
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Inventors:
IIZAKA HIROFUMI
Application Number:
JP2021165660A
Publication Date:
April 19, 2023
Filing Date:
October 07, 2021
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B32B27/36; B32B15/06; H01B5/14
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office