Title:
A cored structure solder vamp and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6226233
Kind Code:
B2
Abstract:
Provided are a solder bump having a cored structure and a production method therefor. In producing a solder bump, first, a core paste is print-coated in the central portion of the bump and, at a temperature close to a solder metal reflow-processing temperature or lower, the core paste is sintered to form a sintered core, then, the solder metal is coated around this sintered core by way of a printing method, and this solder metal is reflow-processed, thereby obtaining a solder bump having a cored structure, wherein a sintered core extending in the vertical direction is formed inside the solder bump.
Inventors:
Nakagawa
Masayuki Ishikawa
Tsukasa Yasoshima
Masayuki Ishikawa
Tsukasa Yasoshima
Application Number:
JP2013270852A
Publication Date:
November 08, 2017
Filing Date:
December 27, 2013
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L21/60
Domestic Patent References:
| JP2005294482A | ||||
| JP6140532A | ||||
| JP2015126159A |
Attorney, Agent or Firm:
Kageyama Shuichi
Masayuki Miyake
Kurachi Yasuyuki
Kazuo Tomita
Masayuki Miyake
Kurachi Yasuyuki
Kazuo Tomita