Title:
電子装置
Document Type and Number:
Japanese Patent JP7293872
Kind Code:
B2
Abstract:
To provide an electronic device capable of adding a connection between an electronic component and a frame ground even after a wiring pattern of a substrate is formed.SOLUTION: An electronic device includes a frame to be grounded, a substrate on which an electronic component is mounted, a conductive support fixed to the frame and supporting the substrate, a screw for screwing the substrate to the support, and a lead wire, having one end electrically connected to the support at the screw and the other end electrically connected to the electronic component on the substrate, provided separately from a wiring pattern on the substrate.SELECTED DRAWING: Figure 3
Inventors:
Hiroki Yano
Shota Miura
Shota Miura
Application Number:
JP2019100943A
Publication Date:
June 20, 2023
Filing Date:
May 30, 2019
Export Citation:
Assignee:
Nippon Seiko Co., Ltd.
International Classes:
H05K7/14; H01R4/64; H01R12/51; H05K1/02
Domestic Patent References:
| JP2011187729A | ||||
| JP201798512A | ||||
| JP58195484U | ||||
| JP2016174079A |
Attorney, Agent or Firm:
Megumi Konishi
Shigeyuki Nagaoka
Shigeyuki Nagaoka