Title:
INSULATED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023132550
Kind Code:
A
Abstract:
To prevent cracking of ceramic substrates in insulated circuit boards consisting of a circuit layer made of copper or copper alloy bonded to a ceramic substrate and a heat sink.SOLUTION: An insulated circuit board 10 consists of a rectangular ceramic substrate 20 in plan view with a circuit layer 30 made of copper or copper alloy bonded to one side and a heat sink 40 made of copper or copper alloy bonded to the other side, and the heat sink 40 has non-bonded areas 51 between the side edges at least at the four corners of the ceramic substrate 20 and the heat sink 40.SELECTED DRAWING: Figure 1
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Inventors:
OHIRAKI TOMOYA
OHASHI TOYO
OHASHI TOYO
Application Number:
JP2022037931A
Publication Date:
September 22, 2023
Filing Date:
March 11, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01L23/36; H01L23/12; H01L23/13
Attorney, Agent or Firm:
Masakazu Aoyama