Title:
A manufacturing method of an elastic wave device and an elastic wave device
Document Type and Number:
Japanese Patent JP6116120
Kind Code:
B2
Abstract:
An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.
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Inventors:
Toshio Nishizawa
Yasuyuki Saito
Yasuyuki Saito
Application Number:
JP2012012406A
Publication Date:
April 19, 2017
Filing Date:
January 24, 2012
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/145; H03H3/08; H03H9/02; H03H9/17; H03H9/54
Domestic Patent References:
| JP2003332874A | ||||
| JP201171912A | ||||
| JP2011259516A |
Foreign References:
| WO2009113274A1 |
Attorney, Agent or Firm:
Shuhei Katayama