Title:
A manufacturing method of a resin multilayer substrate and a resin multilayer substrate
Document Type and Number:
Japanese Patent JP6259813
Kind Code:
B2
Abstract:
A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
Inventors:
Hiroshi Shinagawa
Shigeru Tago
Shigeru Tago
Application Number:
JP2015504447A
Publication Date:
January 10, 2018
Filing Date:
June 05, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
| JP2003249731A | ||||
| JP200976663A | ||||
| JP2010219262A | ||||
| JP2004104037A | ||||
| JP2010135726A | ||||
| JP2009302343A | ||||
| JP4137591A | ||||
| JP201294646A |
Attorney, Agent or Firm:
Kaede International Patent Office
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