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Title:
A manufacturing method of a semiconductor manufacturing device and a semiconductor device
Document Type and Number:
Japanese Patent JP6119400
Kind Code:
B2
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Inventors:
Daisuke Imai
Tetsuya Saruwatari
Ueno Makoto
Application Number:
JP2013091165A
Publication Date:
April 26, 2017
Filing Date:
April 24, 2013
Export Citation:
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Assignee:
SHIMADZU CORPORATION
International Classes:
H01L21/31; C23C16/52; H01L21/02; H01L21/205
Domestic Patent References:
JP2012212919A
JP2012216639A
JP2008258389A
Foreign References:
US6162488
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito



 
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