Title:
A manufacturing method of a solid imaging device
Document Type and Number:
Japanese Patent JP5984015
Kind Code:
B2
Abstract:
Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.
Inventors:
Shunichi Sukegawa
Noriyuki Fukushima
Noriyuki Fukushima
Application Number:
JP2012549045A
Publication Date:
September 06, 2016
Filing Date:
May 26, 2011
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L25/04; H01L23/52; H01L25/18; H01L27/14; H04N5/369; H04N5/374
Domestic Patent References:
| JP2004111572A | ||||
| JP2010010368A | ||||
| JP2001332654A | ||||
| JP2007317741A | ||||
| JP2004207461A | ||||
| JP2007013089A | ||||
| JP2002271700A |
Foreign References:
| WO2010002645A1 |
Attorney, Agent or Firm:
Yoshio Inamoto
Takashi Nishikawa
Takashi Nishikawa
Previous Patent: A manufacturing method of a nonaqueous electrolyte rechargeable battery and the battery
Next Patent: DISUSED MATERIAL INCINERATOR
Next Patent: DISUSED MATERIAL INCINERATOR