Title:
MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2023022396
Kind Code:
A
Abstract:
To provide a molding device allowed to cure an aggregate mixture by a microwave without preventing the aggregate mixture from drying/curing.SOLUTION: A molding device 100 according to an embodiment comprises a pattern 10 that has a lower die 11 and an upper die 12 to be matched together at a parting plane 13 and forms a cavity 14 to charge an aggregate mixture for molding therein and a microwave irradiator 20 that irradiates an aggregate mixture W charged in the cavity 14 with a microwave. The pattern 10 is porous at, at least, an inner face of the cavity 14 and the parting plane 13.SELECTED DRAWING: Figure 2
Inventors:
WATANABE HIROYASU
NAKAYAMA SATOSHI
NAKAYAMA SATOSHI
Application Number:
JP2021127252A
Publication Date:
February 15, 2023
Filing Date:
August 03, 2021
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B22C9/12; B22C7/00; B22C9/02
Attorney, Agent or Firm:
Ken Ieiri