Title:
NON-CROSSLINKED RESIN COMPOSITION AND NON-CROSSLINKED RESIN MOLDED MATERIAL
Document Type and Number:
Japanese Patent JP2018053086
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition from which a resin molded material excellent in flexural modulus can be produced.SOLUTION: Provided is a resin composition comprising a thermoplastic resin, a carbon fiber, a polyamide, and a compatibilizing agent, and in which the polyamide has: a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit in which a lactam is ring-opened and comprising an aromatic ring except for an aramid structural unit; and a structural unit in which an aromatic ring is not contained.SELECTED DRAWING: None
Inventors:
MIYAMOTO TAKESHI
OGOSHI MASAYUKI
MORIYA HIROYUKI
OGOSHI MASAYUKI
MORIYA HIROYUKI
Application Number:
JP2016190266A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
C08L101/00; C08K7/06; C08L23/26; C08L77/00
Domestic Patent References:
| JPH0258552A | 1990-02-27 | |||
| JP2014181307A | 2014-09-29 | |||
| JPH06192448A | 1994-07-12 | |||
| JP2001146533A | 2001-05-29 | |||
| JP2010168526A | 2010-08-05 | |||
| JP2011016909A | 2011-01-27 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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