Title:
RESIN COMPOSITION, AND RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2018053085
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a resin molded body excellent in tensile elastic modulus.SOLUTION: A resin composition contains polyolefin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond, where a content with respect to 100 pts.mass of the polyolefin is more than 20 pts.mass and 100 pts.mass or less, and a compatibilizer.SELECTED DRAWING: None
Inventors:
IWADATE YUKO
OGOSHI MASAYUKI
MORIYA HIROYUKI
MIYAMOTO TAKESHI
NAKAYAMA DAISUKE
OGOSHI MASAYUKI
MORIYA HIROYUKI
MIYAMOTO TAKESHI
NAKAYAMA DAISUKE
Application Number:
JP2016190264A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
C08L23/00; C08J5/04; C08K7/06; C08L23/26; C08L77/00
Domestic Patent References:
| JPH0258552A | 1990-02-27 | |||
| JP2014181307A | 2014-09-29 | |||
| JPH06192448A | 1994-07-12 | |||
| JP2001146533A | 2001-05-29 | |||
| JP2010168526A | 2010-08-05 | |||
| JP2011016909A | 2011-01-27 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office